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Method for manufacturing a surface mount technology (SMT) pad structure for next generation speeds
Method for manufacturing a surface mount technology (SMT) pad structure for next generation speeds
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机译:用于下一代速度的表面安装技术(smt)焊盘结构的制造方法
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摘要
A method for manufacturing a surface mount technology (SMT) pad structure includes attaching an adjacent pair of differential contact strips to a nonconductive surface of respective landing pads of a surface mount technology (SMT) pad structure of a circuit board substrate, the pair of differential contact strips having converging narrowing at a respective distal end and each having a proximal signal trace for conducting a high-speed communication signal to another functional component attached to a circuit board substrate. The method includes attaching a return current strip that is longitudinally aligned adjacent to the pair of differential contact strips on a first lateral side and connected to a ground plane of the circuit board substrate, the converging narrowing of the adjacent differential contact strip increasing separation from a distal end of the return current strip, the separation improving signal integrity by reducing fringe effects, increasing impedance, and quenching resonance.
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