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Surface mount technology (SMT) pad design with differential contact strips having converging narrowing distal ends that facilitate high speed communication
Surface mount technology (SMT) pad design with differential contact strips having converging narrowing distal ends that facilitate high speed communication
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机译:表面贴装技术(SMT)焊盘设计,带差分接触条,其会聚变窄的远端会聚,有助于高速通讯
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摘要
An Information handling system (IHS) includes a circuit board assembly with surface mount technology (SMT) pad structure. Landing pad(s) attached to circuit board substrate have a mounting area that receive an SMT connector pin onto adjacent pair of differential contact strips plated to nonconductive surface and extending longitudinally in parallel alignment. A return current strip is longitudinally aligned, adjacent to the differential contact strips on a first lateral side. The return current strip is connected to a ground plane of the circuit board substrate. Converging narrowing of the adjacent differential contact strip increases separation from a distal end of the return current strip. The separation improves signal integrity by reducing fringe effects, increasing impedance, and quenching resonance. A surface mount device (SMD) has one or more connector pins that are attached to the one or more landing pads to conduct the high-speed communication signal.
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