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DIFFERENT GATE WIDTHS FOR UPPER AND LOWER TRANSISTORS IN A STACKED VERTICAL TRANSPORT FIELD-EFFECT TRANSISTOR STRUCTURE
DIFFERENT GATE WIDTHS FOR UPPER AND LOWER TRANSISTORS IN A STACKED VERTICAL TRANSPORT FIELD-EFFECT TRANSISTOR STRUCTURE
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机译:堆叠式垂直传输场效应晶体管结构中上,下晶体管的门宽不同
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摘要
A method of forming a semiconductor structure includes forming vertical fins comprising a first semiconductor layer, an isolation layer and a second semiconductor layer, the first and second semiconductor layers providing vertical transport channels for lower and upper vertical transport field-effect transistors (VTFETs) of a stacked VTFET structure. The method also includes forming a first gate stack for the lower VTFET surrounding a first portion of the first semiconductor layer of the vertical fins. The method further includes forming a second gate stack for the upper VTFET surrounding a second portion of the second semiconductor layer of the vertical fins. The first and second portions have different sizes such that the upper and lower VTFETs of the stacked VTFET structure have different effective gate widths.
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