首页> 外国专利> DIFFERENT GATE WIDTHS FOR UPPER AND LOWER TRANSISTORS IN A STACKED VERTICAL TRANSPORT FIELD-EFFECT TRANSISTOR STRUCTURE

DIFFERENT GATE WIDTHS FOR UPPER AND LOWER TRANSISTORS IN A STACKED VERTICAL TRANSPORT FIELD-EFFECT TRANSISTOR STRUCTURE

机译:堆叠式垂直传输场效应晶体管结构中上,下晶体管的门宽不同

摘要

A method of forming a semiconductor structure includes forming vertical fins comprising a first semiconductor layer, an isolation layer and a second semiconductor layer, the first and second semiconductor layers providing vertical transport channels for lower and upper vertical transport field-effect transistors (VTFETs) of a stacked VTFET structure. The method also includes forming a first gate stack for the lower VTFET surrounding a first portion of the first semiconductor layer of the vertical fins. The method further includes forming a second gate stack for the upper VTFET surrounding a second portion of the second semiconductor layer of the vertical fins. The first and second portions have different sizes such that the upper and lower VTFETs of the stacked VTFET structure have different effective gate widths.
机译:一种形成半导体结构的方法,包括形成包括第一半导体层,隔离层和第二半导体层的垂直鳍片,第一和第二半导体层提供垂直的沟道,用于垂直的下部和上部垂直传输场效应晶体管(VTFET)。堆叠式VTFET结构。该方法还包括形成用于下部VTFET的第一栅极叠层,该第一栅极叠层围绕垂直鳍的第一半导体层的第一部分。该方法还包括形成用于上VTFET的第二栅叠层,该第二栅叠层围绕垂直鳍的第二半导体层的第二部分。第一部分和第二部分具有不同的尺寸,从而使得堆叠的VTFET结构的上部和下部VTFET具有不同的有效栅极宽度。

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