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Complimentary Metal-Oxide-Semiconductor (CMOS) with Low Contact Resistivity and Method of Forming Same

机译:低接触电阻率的互补金属氧化物半导体(CMOS)及其形成方法

摘要

An embodiment complimentary metal-oxide-semiconductor (CMOS) device and an embodiment method of forming the same are provided. The embodiment CMOS device includes an n-type metal-oxide-semiconductor (NMOS) having a titanium-containing layer interposed between a first metal contact and an NMOS source and a second metal contact and an NMOS drain and a p-type metal-oxide-semiconductor (PMOS) having a PMOS source and a PMOS drain, the PMOS source having a first titanium-containing region facing a third metal contact, the PMOS drain including a second titanium-containing region facing a fourth metal contact.
机译:提供了实施例的互补金属氧化物半导体(CMOS)器件及其形成方法。实施例的CMOS器件包括n型金属氧化物半导体(NMOS),其具有介于第一金属触点和NMOS源极与第二金属触点之间的含钛层以及NMOS漏极和p型金属氧化物-具有PMOS源极和PMOS漏极的半导体(PMOS),该PMOS源极具有面对第三金属接触的第一含钛区域,该PMOS漏极包括面对第四金属接触的第二含钛区域。

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