首页> 外国专利> THERMALLY CONDUCTIVE MEMBER, THERMALLY CONDUCTIVE COMPOSITION, AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE COMPOSITION

THERMALLY CONDUCTIVE MEMBER, THERMALLY CONDUCTIVE COMPOSITION, AND METHOD FOR PRODUCING THERMALLY CONDUCTIVE COMPOSITION

机译:热传导成员,热传导组成以及制造热传导组成的方法

摘要

Provided are a thermally conductive composition that exhibits high adhesive force to an adherend such as a heat-generating element or a heat-dissipating element after curing, and a thermally conductive member in which a cured product of the thermally conductive composition and the adherend are integrated with each other. The thermally conductive composition includes a mixture containing an addition-reaction-type silicone, a thermally conductive filler that includes a metal hydroxide in an amount of 80% by volume or more in terms of volume ratio, and an acryloyl-group-containing silane coupling agent. A thermally conductive member 21 includes a cured body 12 of the thermally conductive composition and an adherend 13 fixed to the cured body 12.
机译:本发明提供一种固化后对发热体或散热元件等被粘物具有高粘合力的导热性组合物,以及使该导热性组合物的固化物与被粘物一体化的导热部件。彼此。导热性组合物包括含有加成反应型硅酮的混合物,以体积比计含有80体积%以上的金属氢氧化物的导热性填料,以及含有丙烯酰基的硅烷偶联剂。代理商。导热构件 21 包括导热组合物的固化体 12 和固定至固化体 12的被粘物 13

著录项

  • 公开/公告号US2020270498A1

    专利类型

  • 公开/公告日2020-08-27

    原文格式PDF

  • 申请/专利权人 SEKISUI POLYMATECH CO. LTD.;

    申请/专利号US201616303395

  • 发明设计人 HIROYA ENDO;

    申请日2016-05-31

  • 分类号C09K5/14;B32B27/20;B32B27/28;B32B9;B32B9/04;B32B15/08;B32B15/20;B32B15/18;C08K3/22;C08K3/28;C08K3/38;C08J5/04;

  • 国家 US

  • 入库时间 2022-08-21 11:23:30

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号