首页> 外国专利> METHOD AND APPARATUS FOR ION ENERGY DISTRIBUTION MANIPULATION FOR PLASMA PROCESSING CHAMBERS THAT ALLOWS ION ENERGY BOOSTING THROUGH AMPLITUDE MODULATION

METHOD AND APPARATUS FOR ION ENERGY DISTRIBUTION MANIPULATION FOR PLASMA PROCESSING CHAMBERS THAT ALLOWS ION ENERGY BOOSTING THROUGH AMPLITUDE MODULATION

机译:等离子体处理腔的离子能量分布操纵的方法和装置,该离子束允许通过振幅调制促进离子能量的爆发

摘要

Methods and apparatus for boosting ion energies are contemplated herein. In one embodiment, the methods and apparatus comprises a controller, a process chamber with a symmetrical plasma source configured to process a wafer, one or more very high frequency (VHF) sources, coupled to the process chamber, to generate plasma density and two or more frequency generators that generate low frequencies relative to the one or more VHF sources, coupled to a bottom electrode of the process chamber, the two or more low frequency generators configured to dissipate energy in the plasma sheath, wherein the controller controls the one or more VHF sources to generate a VHF signal and the two or more low frequency sources to generate two or more low frequency signals.
机译:本文考虑了增强离子能量的方法和设备。在一个实施例中,该方法和装置包括控制器,具有配置成用于处理晶片的对称等离子体源的处理室,耦合至该处理室以产生等离子体密度的一个或多个甚高频(VHF)源以及两个或多个相对于所述一个或多个VHF源产生低频的更多的频率发生器,耦合到所述处理室的底部电极,所述两个或更多的低频发生器被配置为在等离子体鞘中耗散能量,其中所述控制器控制所述一个或多个VHF源产生一个VHF信号,两个或多个低频源产生两个或多个低频信号。

著录项

  • 公开/公告号US2019348260A1

    专利类型

  • 公开/公告日2019-11-14

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC.;

    申请/专利号US201916521206

  • 申请日2019-07-24

  • 分类号H01J37/32;H01L21/3065;H01L21/683;H01L21/3213;H01L21/02;H01L21/67;

  • 国家 US

  • 入库时间 2022-08-21 11:22:06

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