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ANISOTROPIC CONDUCTIVE FILM (ACF) FOR USE IN TESTING SEMICONDUCTOR PACKAGES
ANISOTROPIC CONDUCTIVE FILM (ACF) FOR USE IN TESTING SEMICONDUCTOR PACKAGES
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机译:各向异性导电膜(ACF),用于测试半导体封装
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摘要
Embodiments described herein provide an anisotropic conductive film (ACF) positioned on a semiconductor package and techniques of using the ACF to test semiconductor devices positioned in or on the semiconductor package. In one example, a semiconductor package comprises: a die stack comprising one or more dies; a molding compound encapsulating the die stack; a substrate on the molding compound; a contact pad on a surface of the substrate and coupled to the die stack; a test pad on the surface of the substrate; a conductive path between the contact pad and the test pad, where an electrical break is positioned along the conductive path; and an ACF over the electrical break. Compressing the ACF by a test pin creates an electrical path that replaces the electrical break. Data can be acquired by test pin and provided to a test apparatus, which determines whether the dies in the die stack are operating properly.
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