首页> 外国专利> METHOD FOR MACHINING SPUTTERING TARGET, APPARATUS FOR MACHINING SPUTTERING TARGET, SPUTTERING TARGET, AND METHOD FOR PRODUCING SPUTTERING TARGET PRODUCT

METHOD FOR MACHINING SPUTTERING TARGET, APPARATUS FOR MACHINING SPUTTERING TARGET, SPUTTERING TARGET, AND METHOD FOR PRODUCING SPUTTERING TARGET PRODUCT

机译:溅射靶材的加工方法,溅射靶材的加工装置,溅射靶材以及溅射靶材的制造方法

摘要

A method for machining a sputtering target that includes a sputtering surface, an opposing surface opposite to the sputtering surface, and an outer peripheral surface being between the sputtering surface and the opposing surface comprises the steps of: fixing the sputtering target on a fixing table by mounting the sputtering surface or the opposing surface of the sputtering target on the fixing table; and cutting the outer peripheral surface of the sputtering target by a cutting tool while rotating the cutting tool along a circumferential direction of the outer peripheral surface of the sputtering target.
机译:一种用于加工溅射靶的方法,该方法包括:溅射表面,与该溅射表面相对的相对表面,以及位于该溅射表面与该相对表面之间的外周表面,该步骤包括:通过以下步骤将溅射靶固定在固定台上:将溅射表面或溅射靶的相对表面安装在固定台上;一边使切削工具沿着溅射靶的外周面的周向旋转,一边用切削工具切削溅射靶的外周面。

著录项

  • 公开/公告号US2019351491A1

    专利类型

  • 公开/公告日2019-11-21

    原文格式PDF

  • 申请/专利权人 SUMITOMO CHEMICAL COMPANY LIMITED;

    申请/专利号US201816484242

  • 发明设计人 MASAHIRO FUJITA;KOJI NISHIOKA;

    申请日2018-02-09

  • 分类号B23C3/12;C23C14/34;

  • 国家 US

  • 入库时间 2022-08-21 11:21:24

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