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Apparatus and Method for Measuring Topography and Gradient of the Surfaces, Shape, and Thickness of Patterned and Unpatterned Wafers

机译:测量图案化和未图案化晶片的表面,形状和厚度的形貌和梯度的设备和方法

摘要

An interferometer system may include a stage assembly configured to receive and secure a sample, an illumination source configured to generate an illumination beam, a half-wave plate, one or more shearing prisms to shear the illumination beam into two beamlets along a shearing direction, a reference flat disposed proximate to the sample, a detector assembly, and a controller. The controller may cause the illumination source to generate an illumination beam and sweep the illumination beam across a plurality of wavelengths, and determine both a surface height measurement and a surface slope measurement of the sample based on the illumination received by the detector assembly.
机译:干涉仪系统可包括配置成接收和固定样品的台架组件,配置成产生照明束的照明源,半波片,一个或多个剪切棱镜,以沿剪切方向将照明束剪切成两个子束,靠近样品放置的参考平面,检测器组件和控制器。控制器可以使照明源产生照明束并将照明束扫过多个波长,并基于检测器组件接收的照明来确定样品的表面高度测量值和表面斜率测量值。

著录项

  • 公开/公告号US2020033117A1

    专利类型

  • 公开/公告日2020-01-30

    原文格式PDF

  • 申请/专利权人 KLA CORPORATION;

    申请/专利号US201916517153

  • 发明设计人 CHUNSHENG HUANG;

    申请日2019-07-19

  • 分类号G01B11/24;H01L21/66;

  • 国家 US

  • 入库时间 2022-08-21 11:20:24

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