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Apparatus and Method for Measuring Topography and Gradient of the Surfaces, Shape, and Thickness of Patterned and Unpatterned Wafers
Apparatus and Method for Measuring Topography and Gradient of the Surfaces, Shape, and Thickness of Patterned and Unpatterned Wafers
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机译:测量图案化和未图案化晶片的表面,形状和厚度的形貌和梯度的设备和方法
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摘要
An interferometer system may include a stage assembly configured to receive and secure a sample, an illumination source configured to generate an illumination beam, a half-wave plate, one or more shearing prisms to shear the illumination beam into two beamlets along a shearing direction, a reference flat disposed proximate to the sample, a detector assembly, and a controller. The controller may cause the illumination source to generate an illumination beam and sweep the illumination beam across a plurality of wavelengths, and determine both a surface height measurement and a surface slope measurement of the sample based on the illumination received by the detector assembly.
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