Chemical mechanical polishing composition comprising non-ionic surfactant and aromatic compounds comprising at least one acid group

摘要

A chemical mechanical polishing (CMP) composition (Q) comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a non-ionic surfactant, (C) an aromatic compound comprising at least one acid group (Y), or a salt thereof, and (M) an aqueous medium.