- CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING NON-IONIC SURFACTANT AND AROMATIC COMPOUND COMPRISING AT LEAST ONE ACID GROUP

摘要

The present chemical mechanical polishing (CMP) composition (Q) comprises: (D) inorganic particles, organic particles, or mixtures or complexes thereof (wherein the particles are cocoon-shaped inorganic particles, organic particles, or mixtures or complexes thereof) (E) a non-ionic surfactant, (F) an aromatic compound comprising at least one acid group (Y), or a salt thereof, and (N) aqueous medium.