An integrated machine for conducting temperature tests on electronic components such as chips

摘要

The present invention relates to a machinery (1) for testing one or more electronic components (DUT) at a predetermined controlled temperature (T), the machinery comprising: - A surface (4); - At least a recess for the test (25) obtained in said surface (4) and in which the component under test can be arranged and within which the thermal conditions set for the test are generated; - Means (27, 28a, 28b, 200) for generating a predetermined thermal condition within said recess for the test (25); - Said recess for the test (25) configured for being substantially thermally insulated from the surrounding space, external to the est.