LED VEHICLE LIGHT MODULE, MANUFACTURING METHOD THEREFOR, AND CIRCUIT BOARD FOR USE IN LED VEHICLE LIGHT MODULE

摘要

An LED vehicle light module, a manufacturing method for same, and a circuit board thereof, related to the technical field of light-emitting diodes. The LED vehicle light module comprises the circuit board (10). A circuit pattern (11), an LED solder pad (18), and a lens positioning hole (13) are provided on the circuit board (10). An injection-molded LED limiting element (20) is provided also on the circuit board (10). A limiting hole (21) is provided in the LED limiting element (20). An LED chip (30) is soldered on the LED solder pad (18) and is arranged within the limiting hole (21). Positioning elements (25 and 26) are provided on the circumferential wall of the lens positioning hole (13). The positioning elements (25 and 26) and the LED limiting element (20) are integrally injection molded. The method comprises: providing the circuit pattern (11) and the LED solder pad (18) on the circuit board (10) and drilling at least one positioning reference hole (16) on the on the circuit board (10); injection molding the LED limiting element (20) and the positioning elements (25 and 26) on the circuit board (10), the LED limiting element (20) and the positioning elements (25 and 26) being integrally injection molded, the LED limiting element (20) being arranged circumferentially outside of the LED solder pad (18); the positioning elements (25 and 26) being arranged on the inner wall of the positioning reference hole (16); and soldering the LED chip (30) onto the LED solder pad (18), thus arranging the LED chip (30) in the limiting hole (21).