SUBSTRATE PROCESSING DEVICE, LID OPENING AND CLOSING MECHANISM, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND FLUID PRESSURE DRIVE SYSTEM

摘要

The present invention comprises a lid part (27) that covers a furnace opening of a processing furnace (24), and a lid opening and closing mechanism (26). The lid opening and closing mechanism (26) comprises: a cylinder (32) that comprises a first port (83) and a second port (81), and actuates the lid part; and an arm (29) that couples and secures the lid part and the cylinder. The lid opening and closing mechanism is configured so as to be driven by a fluid pressure drive system (33) comprising: a first supply/exhaust flow path (82) that interconnects the second port (81) of the cylinder and an electromagnetic switching valve (67); a second supply/exhaust flow path (84) that interconnects the first port (83) of the cylinder and the electromagnetic switching valve; a first flow speed adjustment unit (86) and a first check valve (85) provided on the first supply/exhaust flow path; a second flow speed adjustment unit (92) and a second check valve (91) provided on the second supply/exhaust flow path; a first pilot flow path (97) branching from the first supply/exhaust flow path and connected to a pilot port (91a) of the second check valve; and a second pilot flow path (98) branching from the second supply/exhaust flow path and connected to a pilot port (85a) of the first check valve.