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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE COMPRISING SAID SEMICONDUCTOR DEVICE

机译:半导体器件及其制造方法,以及包括所述半导体器件的电子器件

摘要

Disclosed are a semiconductor device and a manufacturing method therefor, and an electronic device comprising the semiconductor device. The semiconductor device comprises: a substrate; and a first device and a second device formed on the substrate, the first device and the second device each comprising: a first source/drain layer, a channel layer, and a second source/drain layer sequentially stacked on the substrate from bottom to top, and a gate stack formed around at least a part of the periphery of the channel layer; at least a part of the respective sidewalls of the channel layers of the first device and the second device extends along different crystal planes or crystal plane families.
机译:公开了一种半导体器件及其制造方法以及包括该半导体器件的电子器件。该半导体器件包括:基板;以及形成在基板上的第一器件和第二器件,所述第一器件和第二器件各自包括:从底部到顶部依次堆叠在所述基板上的第一源/漏层,沟道层和第二源/漏层以及围绕沟道层的至少一部分外围形成的栅堆叠;第一器件和第二器件的沟道层的相应侧壁的至少一部分沿着不同的晶面或晶面族延伸。

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