首页> 外国专利> LASER DIODE CHIP, PACKAGING MODULE, TRANSMISSION APPARATUS, RANGING APPARATUS, AND ELECTRONIC DEVICE

LASER DIODE CHIP, PACKAGING MODULE, TRANSMISSION APPARATUS, RANGING APPARATUS, AND ELECTRONIC DEVICE

机译:激光二极管芯片,包装模块,传输设备,测距设备和电子设备

摘要

The present invention provides a laser diode chip, a laser diode packaging module, a transmission apparatus, a ranging apparatus, and an electronic device. The laser diode chip comprises: a substrate, having a first surface and a second surface; a laser diode array, comprising at least two laser diodes formed on the substrate, the P electrode of each of the laser diodes being formed on the first surface of the substrate, the N electrode of each of the laser diodes being formed on the second surface of the substrate, and the light-emitting regions of each of the laser diodes being respectively formed between the P electrode and the N electrode of said laser diode; the laser diodes using an N electrode driving mode, and the N electrodes of adjacent laser diodes being isolated from each other. The arrangement of the present invention uses a micro/nano-machining process to ensure the accuracy of the relative position between multiple linear light sources, and also implement independent rapid driving of each light source.
机译:本发明提供激光二极管芯片,激光二极管封装模块,传输装置,测距装置和电子设备。激光二极管芯片包括:基板,具有第一表面和第二表面;以及第二基板。激光二极管阵列,其包括形成在基板上的至少两个激光二极管,每个激光二极管的P电极形成在基板的第一表面上,每个激光二极管的N电极形成在第二表面上基板的每个电极的发光电极分别形成在基板的P电极和N电极之间。使用N电极驱动模式的激光二极管,并且相邻的激光二极管的N电极彼此隔离。本发明的装置使用微/纳米加工工艺来确保多个线性光源之间的相对位置的准确性,并且还实现了每个光源的独立快速驱动。

著录项

  • 公开/公告号WO2020087337A1

    专利类型

  • 公开/公告日2020-05-07

    原文格式PDF

  • 申请/专利权人 SZ DJI TECHNOLOGY CO. LTD.;

    申请/专利号WO2018CN112972

  • 发明设计人 LIU XIANG;DONG SHUAI;HONG XIAOPING;

    申请日2018-10-31

  • 分类号H01S5;H01S5/042;H01S5/026;

  • 国家 WO

  • 入库时间 2022-08-21 11:11:31

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