A laser diode packaging module, comprising a substrate (301), which is provided with a mutually opposite first surface (30) and second surface (31); a cover is disposed on the first surface (30) of the substrate (301) and comprises a cover body (302) having a window and an accommodating space that is formed between a window light-transmissive board (303), the substrate (301), and the cover; and a laser diode chip (305) that is disposed within the accommodating space. The laser diode packaging module may reduce distributed inductance present in existing manners of in-line packaging, and increase the intensity of laser transmission. Further provided are a transmitting apparatus, ranging apparatus, and electronic device using the laser diode packaging module.
展开▼
