首页> 外国专利> A VERTICAL SILICON CARBIDE POWER MOSFET AND IGBT AND A METHOD OF MANUFACTURING THE SAME

A VERTICAL SILICON CARBIDE POWER MOSFET AND IGBT AND A METHOD OF MANUFACTURING THE SAME

机译:垂直碳化硅功率MOSFET和IGBT及其制造方法

摘要

Disclosed is a vertical silicon carbide power MOSFET with a 4H-SiC substrate of n+- type as drain and a 4H-Si C epilayer of n--type, epitaxially grown on the 4H-SiC substrate acting as drift region and a source region of p++-type, a well region of p-type, a channel region of p- type and a contact region of n++-type implanted into the drift region and a metal gate insulated from the source and drift region by a gate-oxide. A high mobility layer with a vertical thickness in a range 0.1 nm to 50 nm exemplarily in the range of 0.5 nm to 10 nm is provided at the interface between the 4H-SiC epilayer and the gate-oxide.
机译:公开了一种垂直碳化硅功率MOSFET,其具有n +型的4H-SiC衬底作为漏极和n型的4H-Si C外延层,其外延生长在4H-SiC衬底上作为漂移区和源极区。 p ++型,p型的阱区,p型的沟道区和n ++型的接触区被注入到漂移区中,并且金属栅通过栅极氧化物与源极和漂移区绝缘。在4H-SiC外延层与栅极氧化物之间的界面处设置具有垂直厚度在0.1nm至50nm范围内,例如在0.5nm至10nm范围内的高迁移率层。

著录项

  • 公开/公告号WO2020114666A1

    专利类型

  • 公开/公告日2020-06-11

    原文格式PDF

  • 申请/专利权人 ABB SCHWEIZ AG;

    申请/专利号WO2019EP78725

  • 发明设计人 WIRTHS STEPHAN;MIHAILA ANDREI;KNOLL LARS;

    申请日2019-10-22

  • 分类号H01L29/739;H01L29/78;H01L29/16;H01L29/10;H01L21/331;H01L29/165;

  • 国家 WO

  • 入库时间 2022-08-21 11:10:52

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