METHOD FOR MANUFACTURING THICK COPPER PRINTED BOARD WITH NO PORES IN SOLDER RESIST INK AND PRINTED BOARD MANUFACTURED THEREBY

摘要

The present invention relates to the field of printed circuit board production, and in particular, to a method for manufacturing a thick copper printed board with no pores in a solder resist ink, and a thick copper printed board with no pores in a solder resist ink manufactured thereby. By reasonably formulating primary and secondary solder resist inks, performing primary and secondary printing processes on circuits on two sides of a circuit board, and using pre-curing and post-curing methods in both the primary and secondary printing processes, the present invention can effectively solve the problem of insufficient ink feeding caused by a large height difference between a circuit pattern and a base material of the thick copper board, thereby solving problems such as insufficient resist ink filling for edge wires and the occurrence of residual ink and pores between dense wires. In addition, by printing, baking, exposing, developing and curing both sides of the circuit board at the same time, the present invention can ensure that both sides of the circuit board have the same quality, the quality requirements for the existing thick copper board are satisfied, and the quality is stable, improving the feasibility and convenience of a solder resist process.