首页> 外国专利> WAFER TRANSPORT DEVICE, VAPOR DEPOSITION DEVICE, WAFER TRANSPORT METHOD, AND METHOD FOR MANUFACTURING EPITAXIAL SILICON WAFER

WAFER TRANSPORT DEVICE, VAPOR DEPOSITION DEVICE, WAFER TRANSPORT METHOD, AND METHOD FOR MANUFACTURING EPITAXIAL SILICON WAFER

机译:晶圆运输装置,气相沉积装置,晶圆运输方法以及制造外延硅晶圆的方法

摘要

This wafer transport device is provided with a transfer means and a mounting means for mounting a silicon wafer transferred by the transfer means onto a susceptor (3). The mounting means is provided with a plurality of lift pins (71, 72, 73) and a relative moving means for causing the plurality of lift pins (71, 72, 73) and the susceptor (3) to be moved relative to each other. At least one of the transfer means and the mounting means is configured such that, when the silicon wafer is supported by the plurality of lift pins (71, 72, 73), a specific lift pin (71) makes an initial contact with a lower surface of the silicon wafer.
机译:该晶片传送装置设置有传送装置和用于将通过传送装置传送的硅晶片安装到基座(3)上的安装装置。安装装置设置有多个升降销(71、72、73)和用于使多个升降销(71、72、73)和基座(3)相对移动的相对移动装置。 。传送装置和安装装置中的至少一个被配置为使得当硅晶片由多个升降销(71、72、73)支撑时,特定的升降销(71)与下部升降销进行初始接触。硅晶片的表面。

著录项

  • 公开/公告号WO2020137051A1

    专利类型

  • 公开/公告日2020-07-02

    原文格式PDF

  • 申请/专利权人 SUMCO CORPORATION;

    申请/专利号WO2019JP37641

  • 申请日2019-09-25

  • 分类号H01L21/20;C23C16/458;H01L21/205;H01L21/677;

  • 国家 WO

  • 入库时间 2022-08-21 11:10:23

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