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PLASMA TREATMENT ARRANGEMENT AND METHOD FOR ADAPTING THE SIZE OF A SUPPORT AREA OF THE PLASMA TREATMENT ARRANGEMENT TO THE SIZE OF THE SURFACE TO BE TREATED
PLASMA TREATMENT ARRANGEMENT AND METHOD FOR ADAPTING THE SIZE OF A SUPPORT AREA OF THE PLASMA TREATMENT ARRANGEMENT TO THE SIZE OF THE SURFACE TO BE TREATED
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机译:等离子体处理装置和使等离子体处理装置的支撑区域的尺寸适应待处理表面的尺寸的方法
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摘要
In a plasma treatment arrangement for carrying out dielectrically impeded plasma discharge onto a surface to be treated having a flat electrode unit (4) which has a treatment side, and a control unit (11) which supplies at least one electrode (19) of the electrode unit (4) with a high-voltage AC potential for a power which is required for plasma generation between the at least one electrode (19) and a counterelectrode which forms a reference potential, wherein the at least one electrode (19) which receives the high-voltage AC potential is shielded with a flat dielectric (7), at least on the treatment side, and wherein the flat electrode unit is designed to reduce the size of its support area on the surface to be treated for the purpose of adaptation to the size of the surface to be treated, the adaptation of the support area of the flat electrode unit (4) becomes possible in an unproblematical manner on account of the control unit (11) having a device (14) for determining the size of the adapted support area and a control device for adjusting the power to be output to the at least one electrode (19) in accordance with the determined size of the support area.
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