WATERPROOF COMPONENT, ELECTRONIC EQUIPMENT COMPRISING SAME, WATERPROOFING METHOD USING INSERT-MOLDED BODY, AND WATERPROOFING METHOD FOR ELECTRONIC EQUIPMENT

摘要

Provided is a waterproof component that is an insert-molded body comprising a thermoplastic resin composition and a metal component, wherein the thermoplastic resin composition includes a thermoplastic resin (A) and an inorganic filler (B), the content of the inorganic filler (B) is 8-130 parts by mass relative to 100 parts by mass of the thermoplastic resin (A), the inorganic filler (B) is a spherical inorganic filler (B1) and/or a platy inorganic filler (B2), the spherical inorganic filler (B1) has an average particle size of 2-200 µm, inclusive, and the platy inorganic filler (B2) has an average particle size of 2-200 µm, inclusive, and an average aspect ratio of 10-200, inclusive. Also provided is electronic equipment comprising the waterproof component.