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WATERPROOF COMPONENT, ELECTRONIC EQUIPMENT COMPRISING SAME, WATERPROOFING METHOD USING INSERT-MOLDED BODY, AND WATERPROOFING METHOD FOR ELECTRONIC EQUIPMENT
WATERPROOF COMPONENT, ELECTRONIC EQUIPMENT COMPRISING SAME, WATERPROOFING METHOD USING INSERT-MOLDED BODY, AND WATERPROOFING METHOD FOR ELECTRONIC EQUIPMENT
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机译:防水组件,包含该组件的电子设备,使用嵌件成型的本体的防水方法以及用于电子设备的防水方法
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摘要
Provided is a waterproof component that is an insert-molded body comprising a thermoplastic resin composition and a metal component, wherein the thermoplastic resin composition includes a thermoplastic resin (A), an inorganic toughening agent (B) and a polyolefin (C1) or a long-chain fatty acid compound (C2), and the content of the inorganic toughening agent (B) is 8-130 parts by mass and the content of the polyolefin (C1) or the long-chain fatty acid compound (C2) is 1.0-40 parts by mass relative to 100 parts by mass of the thermoplastic resin (A). Also provided is electronic equipment comprising the waterproof component.
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