首页> 外国专利> WATERPROOF COMPONENT, ELECTRONIC EQUIPMENT COMPRISING SAME, WATERPROOFING METHOD USING INSERT-MOLDED BODY, AND WATERPROOFING METHOD FOR ELECTRONIC EQUIPMENT

WATERPROOF COMPONENT, ELECTRONIC EQUIPMENT COMPRISING SAME, WATERPROOFING METHOD USING INSERT-MOLDED BODY, AND WATERPROOFING METHOD FOR ELECTRONIC EQUIPMENT

机译:防水组件,包含该组件的电子设备,使用嵌件成型的本体的防水方法以及用于电子设备的防水方法

摘要

Provided is a waterproof component that is an insert-molded body comprising a thermoplastic resin composition and a metal component, wherein the thermoplastic resin composition includes a thermoplastic resin (A), an inorganic toughening agent (B) and a polyolefin (C1) or a long-chain fatty acid compound (C2), and the content of the inorganic toughening agent (B) is 8-130 parts by mass and the content of the polyolefin (C1) or the long-chain fatty acid compound (C2) is 1.0-40 parts by mass relative to 100 parts by mass of the thermoplastic resin (A). Also provided is electronic equipment comprising the waterproof component.
机译:提供一种防水成分,其是包含热塑性树脂组合物和金属成分的嵌件成型体,其中所述热塑性树脂组合物包含热塑性树脂(A),无机增韧剂(B)和聚烯烃(C1)或长链脂肪酸化合物(C2),无机增韧剂(B)的含量为8〜130质量份,聚烯烃(C1)或长链脂肪酸化合物(C2)的含量为1.0。相对于100质量份热塑性树脂(A)为-40质量份。还提供了包括防水组件的电子设备。

著录项

  • 公开/公告号WO2020175390A1

    专利类型

  • 公开/公告日2020-09-03

    原文格式PDF

  • 申请/专利权人 KURARAY CO. LTD.;

    申请/专利号WO2020JP07175

  • 发明设计人 SUGAI NAOTO;SHIGEMATSU TAKAHARU;

    申请日2020-02-21

  • 分类号C08K5/09;C08L23/02;C08L101;C08K3;

  • 国家 WO

  • 入库时间 2022-08-21 11:09:37

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