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EUV COMPOSITION FOR FORMING SILICON-CONTAINING EUV RESIST LOWER LAYER FILM INCLUDING ADDITIVE

机译:EUV组合物,用于形成含硅的EUV抗蚀剂下层膜,包括添加剂

摘要

[Problem] An EUV resist underlayer film forming composition having a good resist shape is provided. [Solution] A hydrolyzable silane compound (b) having a polysiloxane (A) containing a hydrolytic condensate of a hydrolyzable silane (a) and a sulfonamide structure, a carboxylic acid amide structure, a urea structure, or an isocyanuric acid structure. A resist underlayer film forming composition for EUV lithography comprising a. A polysiloxane (B) comprising a hydrolyzable condensate of a hydrolyzable silane (a) and a hydrolyzable silane compound (b) having a sulfonamide structure, a carboxylic acid amide structure, a urea structure, or an isocyanuric acid structure. A resist underlayer film forming composition for EUV lithography. Polysiloxane (A) is a cohydrolytic condensate of tetraalkoxysilane, alkyltrialkoxysilane, and aryltrialkoxysilane.
机译:[问题]提供具有良好抗蚀剂形状的EUV抗蚀剂下层膜形成用组合物。 [解决方案]具有聚硅氧烷(A)的水解性硅烷化合物(b),所述聚硅氧烷(A)包含水解性硅烷(a)和磺酰胺结构,羧酸酰胺结构,脲结构或异氰尿酸结构的水解缩合物。用于EUV光刻的抗蚀剂下层膜形成用组合物,其包含a。聚硅氧烷(B),其包含可水解硅烷(a)的可水解缩合物和具有磺酰胺结构,羧酸酰胺结构,脲结构或异氰脲酸结构的可水解硅烷化合物(b)。用于EUV光刻的抗蚀剂下层膜形成组合物。聚硅氧烷(A)是四烷氧基硅烷,烷基三烷氧基硅烷和芳基三烷氧基硅烷的共水解缩合物。

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