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Silicon-containing EUV resist underlayer film-forming composition including additive

机译:包含添加剂的含硅EUV抗蚀剂下层膜形成组合物

摘要

There is provided a composition for forming an EUV resist underlayer film which shows a good resit form. A resist underlayer film-forming composition for EUV lithography, including: polysiloxane (A) containing a hydrolyzed condensate of hydrolyzable silane (a); and hydrolyzable silane compound (b) having a sulfonamide structure, a carboxylic acid amide structure, a urea structure, or an isocyanuric acid structure. A resist underlayer film-forming composition for EUV lithography, including: polysiloxane (B) containing a hydrolyzed condensate of hydrolyzable silane (a) and hydrolyzable silane compound (b) having a sulfonamide structure, a carboxylic acid amide structure, a urea structure, or an isocyanuric acid structure. The polysiloxane (A) is preferably a co-hydrolyzed condensate of a tetraalkoxysilane, an alkyltrialkoxysilane and an aryltrialkoxysilane.
机译:提供了一种用于形成EUV抗蚀剂下层膜的组合物,该组合物显示出良好的残留形式。用于EUV光刻的抗蚀剂下层膜形成用组合物,其包括:含有可水解硅烷的水解缩合物(a)的聚硅氧烷(A);和具有磺酰胺结构,羧酸酰胺结构,脲结构或异氰脲酸结构的水解性硅烷化合物(b)。用于EUV光刻的抗蚀剂下层膜形成用组合物,其包括:聚硅氧烷(B),其包含具有磺酰胺结构,羧酸酰胺结构,尿素结构或可水解硅烷(a)和可水解硅烷化合物(b)的水解缩合物。异氰尿酸结构。聚硅氧烷(A)优选为四烷氧基硅烷,烷基三烷氧基硅烷和芳基三烷氧基硅烷的共水解缩合物。

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