Surface protective adhesive tape for backside grinding of semiconductor wafers and grinding method of semiconductor wafers

摘要

A surface protective adhesive tape for back surface grinding of a semiconductor wafer formed by forming an adhesive layer on one surface side of the substrate, wherein the surface roughness of the surface on which the adhesive layer of the substrate is not formed is Rz = 0.7 to 5.0 μm, The total light transmittance at a wavelength of 500 to 600 nm of the surface protective adhesive tape for backside grinding of the semiconductor wafer is 40 to 80%, and the color difference (ΔEM) of the mirror wafer and the surface protective adhesive tape for backside grinding of the semiconductor wafer. The surface protective adhesive tape for back-grinding of a semiconductor wafer bonded to the surface of a semiconductor wafer having a notch with a difference of the color difference ΔET between the Miller wafer and the surface of the semiconductor wafer having a notch and a semiconductor using the same Wafer grinding method.