CHEMICAL MECHANICAL POLISHING COMPOSITION, CHEMICAL MECHANICAL POLISHING SLURRY, AND POLISHING METHOD OF SUBSTRATE

摘要

The present invention relates to a chemical mechanical polishing composition capable of implementing the polishing rate equivalent to or higher than that of conventional abrasives even if the total metal content is reduced or the significantly higher polishing rate than the conventional abrasives when using the same metal total content as the conventional abrasives, to a chemical mechanical polishing slurry, and to a polishing method of a substrate. The chemical mechanical polishing composition comprises: iron-based metal catalyst; and magnesium-based metal catalyst, wherein the metal content of the iron-based metal catalyst in the total content of the metal catalyst is greater than or equal to the metal content of the magnesium-based metal catalyst.;COPYRIGHT KIPO 2020