THROUGH-TYPE ELECTRODE MANUFACTURING METHOD AND THROUGH-TYPE ELECTRODE MANUFACTURED THEREBY

摘要

Disclosed are a through-type electrode manufacturing method and a through-type electrode manufactured thereby. According to an embodiment of the present invention, the through-type electrode manufacturing method comprises: preparing a main wafer; attaching an auxiliary wafer to both sides of the main wafer; removing a part of the auxiliary wafer to produce a substrate; forming a through hole in the substrate; depositing seed metal on one surface of the substrate to form a seed metal layer on one surface of the substrate and the inlet of the through hole; primarily growing an electrode material in the through hole of the substrate; closing the through hole of the substrate with a finishing layer and then secondarily growing the electrode material in the through hole of the substrate to form an electrode layer; removing the seed metal layer and the finishing layer; and removing the rest of the auxiliary wafer.;COPYRIGHT KIPO 2020