首页> 外国专利> HEAT DISSIPATION COMPLEX INCLUDING MULTI-SIZED PLATE-SHAPED HEAT DISSIPATION FILLER AND HEAT DISSIPATION MEMBER

HEAT DISSIPATION COMPLEX INCLUDING MULTI-SIZED PLATE-SHAPED HEAT DISSIPATION FILLER AND HEAT DISSIPATION MEMBER

机译:散热复合体,包括多尺寸板状散热填料和散热构件

摘要

The present invention relates to a heat dissipation complex including a multi-sized plate-shaped heat dissipation filler and a heat dissipation member, intended to improve heat dissipation characteristics by lowering the internal porosity. In the heat dissipation member according to the present invention, since a linear heat dissipation filler and a multi-sized plate-shaped heat dissipation filter having at least two types of particle size are dispersed in a base substrate formed of a polymer resin, it is possible to improve the heat dissipation characteristics by increasing the density of the heat dissipation fillers in the base substrate having a laminate structure by lowering the internal porosity.;COPYRIGHT KIPO 2020
机译:散热复合体技术领域本发明涉及一种散热复合体,其包括多尺寸的板状散热填充物和散热构件,旨在通过降低内部孔隙率来改善散热特性。在根据本发明的散热构件中,由于线性散热填料和具有至少两种类型的粒径的多尺寸板状散热过滤器分散在由聚合物树脂形成的基础基板中,因此通过降低内部孔隙率来增加具有层压结构的基础基板中散热填充物的密度,可以改善散热特性。; COPYRIGHT KIPO 2020

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