RESIN COMPOSITION FOR BONDING SEMICONDUCTOR ADHESIVE FILM FOR SEMICONDUCTOR DICING DIEBONDING FILM AND METHOD FOR DICING OF SEMICONDUCTOR WAFER USING THE SAME

摘要

The present invention relates to a resin composition for bonding a semiconductor, comprising two types of curing catalyst mixture together with a heat-radiating filler having a specific functional group introduced on a surface, to an adhesive film for a semiconductor produced therefrom, to a dicing die-bonding film, and to a dicing method of a semiconductor wafer. The resin composition for bonding a semiconductor can implement improved thermal conductivity properties.