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EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART
EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART
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机译:嵌入式多层陶瓷电子部件和具有嵌入式多层陶瓷电子部件的印刷电路板
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摘要
The present invention includes a ceramic body including a dielectric layer and having a first and a second main surface facing each other, a first side and a second side facing each other, and a first and a second cross section facing each other; First and second internal electrodes stacked between the dielectric layers and having first and second leads exposed to first and second main surfaces of the ceramic body; And first and second external electrodes extending from the first and second cross-sections of the ceramic body to the first and second main surfaces, the first and second side surfaces, and the first and second main surfaces of the ceramic body. The length from the ends of the first and second external electrodes formed on the first and second external electrodes corresponding to the first and second leads is referred to as G, and is formed on the first and second main surfaces of the ceramic body. The length from the cross section of the ceramic body of the first and second external electrodes to BW and the length from the cross section of the ceramic body to the first and second external electrodes corresponding to the first and second leads are M. This provides a multilayer ceramic electronic component that satisfies 30 µm ≤ G BW-M.
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