EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT FOR EMBEDDING SUBSTRATE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT-EMBEDDED TYPE PRINTED CIRCUIT BOARD

摘要

The present invention includes: a ceramic main body which includes a dielectric layer, has first and second principal planes (S1, S2) mutually facing each other, first and second lateral planes (S5, S6) mutually facing each other, and first and second cross sections (S3, S4) mutually facing each other, and has a thickness which is equal to or less than 250 μm; a first internal electrode and a second internal electrode which are arranged to face each other across the dielectric layer and are alternately exposed to the first lateral plane (S5) or the second lateral plane (S6); and a first external electrode, electrically connected to the first internal electrode, and a second external electrode, electrically connected to the second internal electrode, which are formed in the first and second lateral planes (S5, S6) of the ceramic main body. In a multilayer ceramic electronic component provided by the present invention to embed a substrate, the first external electrode includes a first electrode layer and a first metal layer formed on the first electrode layer, the second external electrode includes a second electrode layer and a second metal layer formed on the second electrode layer, the first external electrode and the second external electrode are formed to be extended to the first and second principal planes of the ceramic main body, and the width of the first external electrode and the width of the second external electrode are formed to be different on the first and second principal planes.;COPYRIGHT KIPO 2014