ADAPTIVE SAMPLING FOR SEMICONDUCTOR INSPECTION RECIPE CREATION DEFECT REVIEW AND METROLOGY

摘要

Adaptive sampling methods and systems are provided for semiconductor inspection recipe generation, defect review, and metrology. Embodiments provide an adaptive sampling method for extracting critical regions from SEM image patches for use in image processing and pattern recognition algorithms and wafer inspection systems where design data for semiconductor chips is not available. The embodiment also uses an output from the wafer inspection system and an adaptive sampling method to select wafer locations to be irradiated on a high resolution review or metrology tool and image processing to efficiently find significant defects and significant deviations in conventional manufacturing processes. And a pattern recognition algorithm.