首页> 外国专利> ETCHING SOLUTION MANAGING APPARATUS ETCHING SOLUTION MANAGING METHOD AND CONCENTRATION MEASURING METHOD FOR COMPONENT OF ETCHING SOLUTION

ETCHING SOLUTION MANAGING APPARATUS ETCHING SOLUTION MANAGING METHOD AND CONCENTRATION MEASURING METHOD FOR COMPONENT OF ETCHING SOLUTION

机译:蚀刻液管理装置蚀刻液成分管理方法及浓度测定方法

摘要

Provided is an etchant management apparatus, an etchant management method, and a method for measuring the component concentration of an etchant that maintains and manages the performance of the oxalic acid-based etchant as an etchant approximately constant and suppresses precipitation of solid particles. A conductivity meter 17 for measuring the conductivity value of the etchant, and a density meter 18 for measuring the density value of the etchant; It is supplied to the etching solution based on the correlation between the oxalic acid concentration and the conductivity value of the etching solution and the measurement result of the conductivity meter 17, and the correlation between the dissolved metal concentration and density value of the etching solution and the measurement result of the density meter 18. It is equipped with a supplement liquid sending liquid control means for controlling the liquid feeding of the supplement liquid.
机译:提供一种蚀刻剂管理设备,一种蚀刻剂管理方法以及一种用于测量蚀刻剂的成分浓度的方法,该方法维持并管理草酸类蚀刻剂作为蚀刻剂的性能大致恒定并且抑制固体颗粒的沉淀。用于测量蚀刻剂的电导率值的电导率仪17和用于测量蚀刻剂的密度值的密度仪18;基于草酸浓度与蚀刻溶液的电导率值之间的相关性以及电导率计17的测​​量结果,以及溶解金属浓度与蚀刻溶液的密度值之间的相关性,将其提供给蚀刻溶液。密度计18的测量结果。其配备有用于控制补充液体的液体供给的补充液体输送液体控制装置。

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