The low melting point provides a solder alloy having excellent heat cycle resistance while suppressing occurrence of non-fusion, improving ductility and bonding strength. The solder alloy has an alloy composition of 35 to 68% Bi, 0.1 to 2.0% Sb, 0.01 to 0.10% Ni, and Sn in the balance by mass%. Preferably, it contains 0.1% or less in total of at least any one of Co, Ti, Al, and Mn. Further, this solder alloy can be suitably used for a solder paste, a solder ball, a resin-embedded solder, and a solder joint.
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