The invention relates to a method for producing damper structures on a micromechanical wafer with the following steps: (A) providing an edge adhesive film and an impression wafer with a first side with an impression structure; (B) applying the edge adhesive film to the first side of the impression wafer at a low atmospheric pressure; (C) application of the edge adhesive film to the first side of the impression wafer by increasing the atmospheric pressure; (D) filling the impression structures with an adhesive; (E) curing the adhesive to form damper structures; (F) Connect the damper structures to a second side of a micromechanical wafer.
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