Composite ceramic for a circuit board

摘要

A composite ceramic (10) for a printed circuit board, comprising - A core layer (1) made of a first ceramic material and - A cover layer (2) made of a second ceramic material for at least partially covering the core layer (1), the cover layer (2) being directly bonded to the core layer (1) and a ratio of a cover layer thickness (DD1) to a core layer thickness (DP) assumes a value less than 0.2, characterized in that the cover layer (2) comprises Si ₃ N ₄ , TSZ or ZTA.