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CERAMIC-COPPER COMPOSITE, METHOD OF PRODUCING CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, AND POWER MODULE
CERAMIC-COPPER COMPOSITE, METHOD OF PRODUCING CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, AND POWER MODULE
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机译:陶瓷铜复合材料,制造陶瓷 - 铜复合材料,陶瓷电路板和电源模块的方法
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摘要
A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer. When a region having a length of 1,700 μm in a long-side direction is a region P on a cut surface of the ceramic-copper composite obtained when the ceramic-copper composite is cut with a plane perpendicular to a main surface of the ceramic-copper composite, an average crystal grain size D1 of copper crystals at least partially present in a region P1 within 50 μm on a side of the copper layer from an interface between the ceramic layer and the brazing material layer in the region P is 30 μm or more and 100 μm or less.
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