CERAMIC-COPPER COMPOSITE, METHOD FOR PRODUCING CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, AND POWER MODULE

摘要

Provided is a flat ceramic-copper composite equipped with a ceramic layer, a copper layer, and a brazing material layer present between the ceramic layer and the copper layer. The average crystal grain size D1 of copper crystals present at least partially in region P1 within 50 μm on the copper-layer side from the interface of the ceramic layer and the brazing material layer in region P is 30-100 μm, where the region P is a region having a length of 1700 μm in the lengthwise direction on a cut surface obtained by cutting the ceramic-copper composite along a plane perpendicular to the main surface.