ELECTRONIC ASSEMBLY AND PRESSURE MEASURING DEVICE WITH IMPROVED DURABILITY

摘要

Device (10) comprising an electronic assembly (1) comprising an electronic component (2) assembled on a first substrate (3), and a body (11) defining a cavity (12) of which a first end (12.1) is in fluid connection with a fluid (14), the electronic component extending in the cavity (12) and the first substrate (3) comprising a portion (7. 1, 7.3) in contact with a wall of the cavity (12), in which the coefficient of thermal expansion of the material of the first substrate (3) is lower than that of the electronic component (2), and the electronic component (2) is assembled by an assembly method with heat input of brazing type on the first substrate (3). Method for producing an electronic assembly Assembly (1) obtained by the method