首页> 外国专利> Improved manufacturing method for rough solder

Improved manufacturing method for rough solder

摘要

A dry metallurgy process for producing coarse solder from selected raw materials for the levels of Sn, Cu, Sb, Bi, Zn, as, Ni and Pb is disclosed, which means at least the step of obtaining a liquid bath of slag in the furnace and reducing the energy of the reducing agent and the option The step of separating the coarse solder from the slag and removing the liquid from the furnace.What is further disclosed isAt least 9.5 to 69 weight% tin and at least 25% by weight of lead;Tin and lead are at least 80% tin and lead0.08 to 12 weight percent copper0.15 to 7 weight% antimony and0.012 to 1.5 weight% bismuth and0.010 to 1.1% by weight of zincWith up to 3 weight% arsenicMaximum 2.8 weight% nickel andUp to 0.7% by weight of zincWith up to 7.5 weight% ironIt is a coarse solder containing up to 0.5% by weight of aluminum.Coarse solder can be further readily prepared to be suitable as raw material for vacuum distillation.Diagram

著录项

相似文献

  • 专利
  • 外文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号