LIGHT EMITTING DIODE WITH IMPROVED SOLDERING STRUCTURE, METHOD FOR ASSEMBLING LIGHT EMITTING DIODE TO SUBSTRATE BY SOLDERING, AND LIGHT EMITTING DIODE ASSEMBLY MANUFACTURED BY THE ASSEMBLING METHOD

摘要

PPROBLEM TO BE SOLVED: To provide an LED with an improved soldering structure, a method for assembling the LED to a substrate by soldering, and an LED assembly manufactured by the assembling method. PSOLUTION: The LED comprises an LED chip, a pair of leads each having one end coupled electrically with the LED chip and the other end coupled with an external power supply and formed with a groove or a hole, a package body sealing a part of the lead on the LED chip side, and a transparent lens applied to one side of the package body on the LED chip side so that light emitted from the LED chip exits sidewards. By such an arrangement, work conditions are improved when soldering work is performed by mounting the other end of the lead on solder and strength after soldering can be enhanced while saving the solder material. PCOPYRIGHT: (C)2007,JPO&INPIT