PRINTED CIRCUIT BOARD RESIN LAMINATE FOR FORMING FINE VIA HOLE, AND MULTILAYER PRINTED CIRCUIT BOARD HAVING FINE VIA HOLE IN RESIN INSULATING LAYER AND METHOD FOR MANUFACTURING SAME

摘要

A method for processing or manufacturing a printed wiring board capable of forming via holes having a small difference in diameter between the top diameter and the bottom diameter while miniaturizing the top diameter, and providing a resin laminate used in such a method. A resin laminate for printed wiring boards comprising a resin insulating layer for forming fine via holes and a release film for laser attenuation laminated on the resin insulating layer, wherein the thickness of the release film for laser attenuation is greater than 50 μm and less than 180 μm. By making it, it is possible to form a via hole having a top diameter of 30 µm or less and a difference between the top diameter and the bottom diameter of 10 µm or less.