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Comparative assessment of the conditions of direct and electrochemical metallization of blind holes of multilayer printed circuit boards

机译：多层印刷电路板盲孔的直接电化学金属化条件的比较评估

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Radic R. Latypov; Alexandra O. Desyatova; Sergey V. Golybev; Larisa N. Maskaeva; Vyacheslav F. Markov;
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1. An Efficient Metal-Core Printed Circuit Board With a Copper-Filled Through (Blind) Hole for Light-Emitting Diodes [J] . Wu J.-Y., Chen C.-M., Horng R.-H., Electron Device Letters, IEEE . 2013,第1期

机译：带有用于发光二极管的铜填充通孔（盲孔）的高效金属芯印刷电路板
2. X-Ray Imaging Inspection System for Blind Holes in the Intermediate Layer of Printed Circuit Boards with Neural Network Identification [J] . C.-S. Lin, B.-E. Chan, Y.-C. Huang, Journal of testing and evaluation . 2017,第3期

机译：带有神经网络识别的印刷电路板中间层盲孔X射线成像检查系统
3. A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board [J] . E. S. W. Leung, W. K. C. Yung, W. B. Lee The International Journal of Advanced Manufacturing Technology . 2004,第7a8期

机译：激光辅助晶种机制在印刷电路板盲孔电镀中产生微孔的研究
4. The use of surfactants and post supercritical CO2 mixing on the electroless nickel metallization of blind holes in printed circuit board [C] . Jun-Wei Su, Chen-Hsin Yao, Chun-Ying Lee, International Microsystems, Packaging, Assembly and Circuits Technology Conference . 2017

机译：表面活性剂和超临界CO 2 混合在印刷电路板盲孔化学镀镍金属化中的应用
5. Large-area, low-cost via formation and metallization in multilayer thin film interconnection on printed wiring boards (PWB) [D] . Li, Weiping 1999

机译：印刷线路板（PWB）上多层薄膜互连中的大面积，低成本通孔形成和金属化
6. Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix [O] . Shantonu Biswas, Andreas Schoeberl, Yufei Hao, -1

机译：集成多层可拉伸印刷电路板为可变形有源矩阵铺平了道路
7. Quality control method of blind via hole based on monitoring Cu direct laser processing in high heat radiation printed circuit board with a high speed camera [O] . Toshiki HIROGAKI, Eiichi AOYAMA, Keiji OGAWA, 2016

机译：高速摄像机高热辐射印刷电路板监测Cu直接激光加工的盲通孔质量控制方法
8. Development of Nondestructive Testing Techniques for Plated-Through Holes in Multilayer Printed Circuit Boards [R] . Anthony, P. L., Mcmurtrey, J. E. 1971

机译：多层印刷电路板镀通孔无损检测技术的发展

Comparative assessment of the conditions of direct and electrochemical metallization of blind holes of multilayer printed circuit boards

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