The present disclosure relates to a gene sequencing structure, chip, system, and method. The gene sequencing structure comprises: a first electrode and a second electrode spaced apart from each other, a semiconductor layer, a sensing electrode, an insulating layer, and a sensitive film layer. The first electrode is connected to the second electrode via the semiconductor layer, the sensing electrode is in contact with the sensitive film layer, and the insulating layer isolates each of the sensitive film layer and the sensing electrode from each of the first electrode, the second electrode, and the semiconductor layer, wherein the sensitive film layer generates charges in response to receiving ions generated by base pairing during gene sequencing.
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