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The use of a CFBG sensor for detecting damage in composite laminates and adhesively bonded joints

机译:使用CFBG传感器检测复合材料层压板和粘接接头的损坏

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摘要

Reliable in-situ damage detection techniques which can detennine the existence and location of damage in composite materials and structures are critical for the effective use of these materials. In this work, embedded chirped fibre Bragg grating (CFBG) sensors have been shown to be successful for both detection and location of matrix cracks in composite laminates and disbond detection in bonded composite joints. In all the cases, the CFBG reflection spectra were predicted using commercial software and agreed well with the experimental results. In the matrix cracking work, single matrix cracks in cross-ply GFRP (glass' fibre reinforced plastic) laminates were detected and located using a CFBG sensor embedded within the 0° plies, near the 0/90 interface. The CFBG sensor showed an approximately sinusoidal variation of the intensity of the reflected spectrum at the position of the crack, enabling both crack development and crack position to be identified. It was shown that the precise position of the cracks does not correspond with the bottom of a dip in the reflected spectrum, as has previously been thought. Disbond initiation and progression from either end of a composite bonded joint was monitored by embedding the CFBG sensor in one of the GFRP adherends, with the low wavelength end ofthe sensor positioned at the cut end ofthe adherend. A shift in the low wavelength end of the spectrum to lower wavelengths indicated disbond initiation and movement of a perturbation in the reflected spectrum towards higher wavelengths indicated disbond propagation. In a related fashion, disbond initiation and propagation was detected from the high-wavelength end ofthe spectrum (adjacent to the other cut end of the adherend). With the aid of a parametric study based on a closed-form solution for the strain field in the bonded joint (available in the literature), it has been shown that the sensitivity ofthe CFBG sensor in detecting the disbond depends mainly on the position of the sensor within the adherend and the strain distribution in the adherend. Finally, artificial manufacturing defects were introduced into GFRP-GFRP bonded joints using Teflon inserts and it has been demonstrated that the location of the defects is possible using the CFBG technique.
机译:可靠的原位损伤检测技术可以确定复合材料和结构中损伤的存在和位置,对于有效使用这些材料至关重要。在这项工作中,嵌入式chi光纤布拉格光栅(CFBG)传感器已被证明可以成功地检测和定位复合材料层压板中的基体裂缝,并检测粘合复合接头中的脱胶。在所有情况下,CFBG反射光谱都是使用商业软件预测的,并且与实验结果非常吻合。在基体开裂工作中,使用嵌入在0°层中的CFBG传感器(靠近0/90接口)检测并定位了交叉GFRP(玻璃纤维增​​强塑料)层压板中的单个基体裂纹。 CFBG传感器显示了在裂纹位置处反射光谱强度的近似正弦变化,从而可以识别裂纹发展和裂纹位置。结果表明,裂纹的精确位置与反射光谱中凹陷的底部不符,这是以前所认为的。通过将CFBG传感器嵌入其中一个GFRP粘附体中,监控传感器从复合粘合接头的任一端开始剥离的过程,传感器的低波长端位于粘附体的切割端。光谱的低波长端向较低波长的偏移指示了解键起始,而反射光谱中的扰动向较高波长的移动指示了解键传播。以一种相关的方式,从光谱的高波长端(与被粘物的另一个切割端相邻)检测到了脱粘引发和传播。借助于基于封闭形式的键合接头中应变场的参数化研究进行的参数研究(可从文献中获得),已经表明CFBG传感器检测脱胶的灵敏度主要取决于传感器的位置。被粘物内的传感器和被粘物内的应变分布。最后,使用特氟龙刀片将人工制造缺陷引入到GFRP-GFRP粘结接头中,并且已经证明使用CFBG技术可以定位缺陷。

著录项

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    Palaniappan Jayanthi;

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  • 年度 2008
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  • 原文格式 PDF
  • 正文语种 English
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