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Measurement of the thermoelectric properties of phenylacetylene capped silicon nanoparticles and their potential in fabrication of thermoelectric materials

机译:苯乙炔封端硅纳米粒子的热电性能测量及其在热电材料制备中的潜力

摘要

Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk silicon. Silicon nanoparticles (SiNPs) are easier to synthesize and show a greater number of surface defects, which suggests that more efficient phonon scattering can be achieved, but these materials also show low electrical conductivity due to defects within the materials unless pressed at high temperatures (1100°C). Conjugated capping layers show the potential to bridge these defects, giving higher conductivity without the need for this process. Phenylacetylene-capped SiNPs are synthesized via the micelle reduction method and pressed into a pellet. Measurements of the electrical conductivity, Seebeck coefficient, and thermal conductivity were taken. The results show that the material produced from these particles shows a relatively high Seebeck coefficient (3228.84 μV K−1) which would have a positive effect on the figure of merit (ZT). A respectable electrical conductivity (18.1 S m−1) and a low thermal conductivity (0.1 W m−1 K−1) confirm the potential of using conjugated molecules as a way of cross-linking between nanoparticles in a bulk material fabricated from SiNPs. These results give a figure of merit of 0.57, which is comparable to better established thermoelectric materials.
机译:硅是制造热电材料的极具吸引力的材料。纳米结构的硅材料,例如硅纳米线(SiNWs),由于有效的声子散射表现出低的热导率,因此具有巨大的潜力,但其电导率与体硅相似。硅纳米粒子(SiNPs)易于合成并显示出更多的表面缺陷,这表明可以实现更有效的声子散射,但是由于材料内部的缺陷,除非在高温下进行压制,否则这些材料的电导率也较低(1100 °C)。共轭盖层显示出弥合这些缺陷的潜力,无需此过程即可提供更高的导电性。苯乙炔封端的SiNPs通过胶束还原法合成并压成小丸。进行了电导率,塞贝克系数和热导率的测量。结果表明,由这些颗粒产生的材料显示出较高的塞贝克系数(3228.84μVK-1),这会对品质因数(ZT)产生积极影响。良好的电导率(18.1 S m-1)和低的热导率(0.1 W m-1 K-1)证实了使用共轭分子作为由SiNPs制成的块状材料中纳米粒子之间交联方式的潜力。这些结果给出的品质因数为0.57,可以与更好地建立的热电材料相媲美。

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