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Stuck in a stack—Temperature measurements of the microclimate around split type condensing units in a high rise building in Singapore

机译:困在堆栈中 - 新加坡高层建筑中分体式冷凝机组周围小气候的温度测量

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摘要

The use of air-conditioning, the largest energy demand for buildings in the tropics, is increasing as regional population and affluence grow. The majority of installed systems are split type air-conditioners. While the performance of new equipment is much better, the influence of the microclimate where the condensing units are installed is often overlooked. Several studies have used CFD simulations to analyse the stack effect, a buoyancy-driven airflow induced by heat rejected from condensing units. This leads to higher on-coil temperatures, deteriorating the performance of the air-conditioners. We present the first field measurements from a 24-storey building in Singapore. A network of wireless temperature sensors measured the temperature around the stack of condensing units. We found that the temperatures in the void space increased continuously along the height of the building by 10–13 °C, showing a significant stack effect from the rejected heat from condensing units. We also found that hot air gets stuck behind louvres, built as aesthetic barriers, which increases the temperature another 9 °C. Temperatures of around 50 °C at the inlet of the condensing units for floors 10 and above are the combined result, reducing the unit efficiency by 32% compared to the undisturbed design case. This significant effect is completely neglected in building design and performance evaluation, and only with an integrated design process can truly efficient solutions be realised.
机译:随着区域人口和富裕程度的增加,空调的使用(热带地区建筑最大的能源需求)正在增加。大多数已安装的系统是分体式空调。尽管新设备的性能要好得多,但通常会忽略安装冷凝单元的微气候的影响。一些研究已经使用CFD模拟来分析烟囱效应,这是由冷凝单元排出的热量引起的浮力驱动的气流。这会导致线圈上的温度升高,从而降低空调的性能。我们展示了新加坡24层建筑物中的第一批现场测量结果。无线温度传感器网络测量冷凝单元堆叠周围的温度。我们发现,空隙空间中的温度沿着建筑物的高度连续升高10-13°C,这表明冷凝单元排出的热量产生了显着的堆叠效应。我们还发现,热风被卡在百叶窗后面,而百叶窗是作为美学屏障而建立的,将温度再升高9°C。地板10及更高楼层的冷凝单元入口处的温度大约为50°C,这是综合结果,与无干扰设计情况相比,该单元效率降低了32%。这种重大影响在建筑设计和性能评估中被完全忽略,只有通过集成的设计过程才能实现真正有效的解决方案。

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