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Design, Simulation, Fabrication, and Preliminary Tests of 3D CMS Pixel Detectors for the Super-LHC

机译:用于3D CMS像素检测器的设计,仿真,制造和初步测试 超级大型强子对撞机

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摘要

The Super-LHC upgrade puts strong demands on the radiation hardness of the innermost tracking detectors of the CMS, which cannot be fulfilled with any conventional planar detector design. The so-called 3D detector architectures, which feature columnar electrodes passing through the substrate thickness, are under investigation as a potential solution for the closest operation points to the beams, where the radiation fluence is estimated to reach 10(16) n(eq)/Tcm(2). Two different 3D detector designs with CMS pixel readout electronics are being developed and evaluated for their advantages and drawbacks. The fabrication of full-3D active edge CMS pixel devices with p-type substrate has been successfully completed at SINTEF. In this paper, we study the expected post-irradiation behaviors of these devices with simulations and, after a brief description of their fabrication, we report the first leakage current measurement results as performed on wafer.
机译:Super-LHC升级对CMS最内层跟踪探测器的辐射硬度提出了很高的要求,而任何常规的平面探测器设计都无法满足这种要求。正在研究所谓的3D检测器体系结构,其特征是柱状电极穿过基板厚度,正在作为最接近光束的工作点的潜在解决方案进行研究,据此辐射通量估计达到10(16)n(eq) / Tcm(2)。目前正在开发两种不同的带有CMS像素读出电子设备的3D检测器设计,并对其优缺点进行评估。在SINTEF成功完成了带有p型衬底的全3D有源边缘CMS像素器件的制造。在本文中,我们通过仿真研究了这些器件的预期辐照后行为,并在对其制造进行了简要说明之后,报告了在晶片上执行的首次泄漏电流测量结果。

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