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Dissolution and recovery of gold with cyanide replacing hydrometallurgical processes.

机译:用氰化物溶解和回收金,取代了湿法冶金工艺。

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摘要

Cyanide is used in leaching phase of hydrometallurgical recovery of gold. The toxicity and environmental risks have created a need for safer alternatives. The goal of this thesis is to study leaching of gold with cyanide replacing alternatives that are utilized in normal air pressure and below temperatures of 100⁰C.In the theoretical part of the thesis primary and secondary sources of gold were studied. Hydrometallurgical recovery of gold among bioleaching and biosorption as process phases in the production were included in the study. The potential cyanide leaching alternatives examined were ammonium thiosulphate, halides, thiourea and thiocyanate. Solutions were studied bothby electrochemical and reactor leaching tests. The behaviour of gold was examined with polarisation runs to determine the adequate redox potential levels for dissolution of gold. Potential measurements were utilized to find out the suitable oxidant concentrations for each solution inorder to raise the redox potential to the level where gold dissolution can take place. Weight loss measurements were used to observe the dissolution rate of gold in the solutions containing allthe needed components for leaching. Complete leaching solutions were utilized in the reactor tests for leaching of gold from autoclave treated ore concentrate and flotation treated groundprinted circuit board (PCB) material that originated from mobile phones. In order to follow an assumption for higher the gold recovery rate, a batch of ore concentrate was bioleached and a batch of flotation concentrate of ground PCB material was acid treated as pretreatment.Based on preliminary polarisation runs and potential measurements, ammonium thiosulphate was evaluated to dissolve gold slower than on the rate predetermined for cyanide solution, 2,5mg/cm2h. A halide alternative, chloride-hypochlorite, exhibited a dissolution rate of 8,6 mg/cm2h in redox potential of 900 mV vs. SHE. Gold dissolved in thiocyanate in a rate of 3,4 mg/cm2h in redox potential of 620 mV vs. SHE. Thiourea had a dissolution rate of 1,65 mg/cm2h in redox potential of 450 mV vs. SHE. In the reactor tests the recovery rates of gold from ore concentrate were 24 % for thiourea, 23 % for chloride and 10 % for thiocyanate. Bioleached material showed recoveries of 10 %, 23 % and 9 % respectively. Gold recoveries from the acid treated PCB material were 16 % for thiourea, 24 % for chloride and 11 % for thiocyanate. Recoveries for PCB material without pretreatment with acid were 32 % for chloride and 21 % with thiocyanate. Thiourea recovery result was found to be faulty due to apparent error in metal analysis.Although the electrochemical tests showed adequate dissolution rates for gold, the recoveries were found to be generally poor in the successive reactor tests. Low recovery rates may be due to gold dissolution disturbing elements in the original materials, premature oxidation of complexants or reprecipitation of gold because of low level of redox potential. Copper and nickel were observed to leach effectively from PCB material. Bioleaching lowered gold recovery rate due to possible sulphur compounds precipitated on the gold surface.
机译:氰化物用于金的湿法冶金浸出阶段。毒性和环境风险引起了对更安全替代品的需求。本文的目的是研究用氰化物替代金的浸出方法,该方法用于常压和低于100°C的温度下。在论文的理论部分,研究了金的主要和次要来源。该研究包括在生物浸出和生物吸附过程中金的湿法冶金回收,这是生产过程中的各个阶段。检查的潜在氰化物浸出替代品是硫代硫酸铵,卤化物,硫脲和硫氰酸盐。通过电化学和反应器浸出试验研究了溶液。用极化运行检查了金的行为,以确定用于溶解金的足够的氧化还原电势水平。利用电位测量来找出每种溶液的合适氧化剂浓度,以将氧化还原电位提高到可能发生金溶解的水平。重量损失测量被用来观察金在包含用于浸提的所有必需组分的溶液中的溶解速率。完整的浸提溶液用于反应器测试中,以从高压灭菌的矿石精矿和浮选处理的源自手机的接地印刷电路板(PCB)材料中浸提金。为了遵循更高金回收率的假设,对一批矿石精矿进行了生物浸出,并对一批研磨过的PCB材料的浮选精矿进行了酸处理,然后进行了初步极化和电势测量,对硫代硫酸铵进行了评估。溶解金的速度比氰化物溶液预定的速度(2.5mg / cm2h)慢。与SHE相比,卤化物替代物氯化物-次氯酸盐在900 mV的氧化还原电势下的溶解速率为8.6 mg / cm2h。与SHE相比,金以3.4 mg / cm2h的速率溶解在硫氰酸盐中,氧化还原电位为620 mV。与SHE相比,硫脲在氧化还原电位为450 mV时的溶解速率为1.65 mg / cm2h。在反应堆测试中,从矿石精矿中回收金的硫脲含量为24%,氯化物回收率为23%,硫氰酸盐回收率为10%。生物浸出材料的回收率分别为10%,23%和9%。从酸处理过的PCB材料中回收的金,硫脲的回收率为16%,氯化物的回收率为24%,硫氰酸盐的回收率为11%。未经酸预处理的PCB材料的回收率是氯化物为32%,硫氰酸盐为21%。硫脲的回收结果由于金属分析中的明显误差而被发现是错误的。尽管电化学测试显示出足够的金溶解速度,但在随后的反应器测试中发现回收率通常很差。回收率低可能是由于原始材料中的金溶解干扰元素,络合物的过早氧化或由于氧化还原电位低而导致的金再沉淀。观察到铜和镍会从PCB材料中有效浸出。由于生物浸出降低了金的回收率,这是由于可能在金表面沉淀了硫化合物。

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    Kähäri Mikko;

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